Novanta Laser Processing Integrator Packages Enable Faster System Setups
The configurable CO2 laser and scan head subsystem simplifies integration.
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Novanta’s configurable laser processing Integrator Packages help OEMs and system integrators get machines and in-line laser processing systems up and running faster and easier. The complete factory pre-aligned and calibrated subsystem includes a CO2 laser source, scan head, controller, software, beam expander, connector cables and mounting hardware, all from a single source.
For OEMs and system integrators, the integrator packages save precious time and resources that are typically associated with integrating individual components provided by separate suppliers. Difficulties associated with sourcing, designing, aligning and supporting individual components for CO2 laser processing systems are resolved with the laser processing Integrator Packages. Additionally, the Integrator Package is enhanced with Novanta ScanMaster Controller (SMC) and ScanMaster Designer (SMD), a leading laser controller and software package.
“Our new Integrator Packages eliminate the high costs, long development time and technical support frustrations shared by our customers,” says Kristen Hill, Novanta’s director of Product Management. “The new Integrator Package is a significant upgrade from its predecessors. The addition of SMC/SMD unlocks the latest advancements in laser control that improve throughput and processing quality.”
The packages eliminate component compatibility issues and runaround technical support. Users can customize power, wavelength, cooling and field sizes to meet specific application needs. The packages also simplify service and support with one partner, one comprehensive warranty and access to a global network of technical and application support. Novanta also offers options for flexible onsite and remote training.
The laser processing Integrator Packages are well suited for a wide range of applications, including marking and coding, engraving, polymer additive manufacturing, material processing and ablation.
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